SYSTEMS AND METHODS FOR SUBSTRATE POLISHING DETECTION USING IMPROVED FRICTION MEASUREMENT

摘要

Methods, apparatus, and systems for polishing a substrate are disclosed. The apparatus includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the apparatus includes a first carriage; a side force or displacement measurement instrument coupled to the first carriage; and a second carriage coupled to the side force or displacement measurement instrument, and wherein one of the first and second carriages is adapted to support a polishing head. Numerous additional aspects are disclosed.