| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent peeling between a die pad part made from plate material and a semiconductor chip that is joined to an upper surface thereof by solder, in a semiconductor package in which the die pad part and the semiconductor chip are sealed with sealing resin. <P>SOLUTION: In a semiconductor package 1, a die pad part 3 is constituted with an arrangement plate part 11 formed in flat plate in which a semiconductor chip is joined to an upper surface 11a, and a multiple bending part 15 including a rising part 12 which is bent from the arrangement plate part 11 and extended above the upper surface 11a, and a folding back part 13 which is bent from an upper end thereof in the direction opposite to the rising part 12 and is extended in the direction separating from the arrangement plate part 11, along the upper surface 11a. The rising part 12 is bent at an angle of 90° or more from a virtual extension line that extends outward from a peripheral edge of the upper surface 11a of the arrangement plate part so as to face the upper surface 11a. The multiple bending part 15 is sealed with sealing resin 6. The multiple bending parts 15 are formed as a pair at a position for sandwiching the semiconductor chip. <P>COPYRIGHT: (C)2013,JPO&INPIT |
