| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition having excellent flame retardancy, heat resistance and metal foil peel strength without containing a halogen compound, and a prepreg using the same, a metal-clad laminate and a printed wiring board. <P>SOLUTION: The resin composition contains (a) a phosphinate represented by formula (1), (b) a thermosetting resin and (c) a curing agent for the thermosetting resin, wherein the phosphinate (a) has an average particle diameter of 2-5 μm and a specific surface area of 2.0-4.0 m<SP POS="POST">2</SP>/g. In formula (1), R<SB POS="POST">1</SB>and R<SB POS="POST">2</SB>may be the same or different and denote linear or branched 1-6C alkyl and/or aryl; M is at least one metal selected from the group consisting of Mg, Ca, Al, Sb, Sn, Ge, Ti, Zn, Fe, Zr, Ce, Bi, Sr, Mn, Li, Na and K; and m is an integer of 1-4. <P>COPYRIGHT: (C)2013,JPO&INPIT |
