| 摘要 |
According to a mode of the present invention, since a conductive pattern having a graded composition structure in which a content ratio of a conductive polymer decreases while a content ratio of metal microparticles increases from a base material is formed with respect to a thickness direction, adhesion with the base material is secured at a bonding portion between the base material and the conductive pattern due to the high content ratio of the conductive polymer and, at the same time, favorable electrical performance is produced by increasing the content ratio of the metal microparticles.
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