| 摘要 |
The present invention relates to thermoplastic molding compositions comprising: a) 0 to 99.7% by weight of one or more styrene copolymers as component A; b) 0.1 to 10% by weight of the compounds of the formulae I, II, III, IV and V or isomers thereof as component B; c) 0.2 to 0.9% by weight of a compound of the formula (VI) as component C; d) 0 to 0.9% by weight of a mixture of the formula (VII) as component D; e) 0 to 0.5% by weight of a compound of the formula (VIII) as component E, or 0 to 0.5% by weight of a compound of the formula (IX), where X = (1), or 0 to 0.5% by weight of a compound of the formula (X), or 0 to 0.5% by weight of a compound of the formula (XI); f) 0 to 10% by weight of one or more additives other than components B, C, D and E, as component F, and with the proviso that when component D is 0% by weight, component E is 0.01 to 0.5% by weight of one or more of compounds VIII, IX, X or XI, where the percentages by weight are each based on the total weight of components A to F and together add up to 100% by weight. |
