发明名称 |
A METHOD OF CUTTING AN OPTICAL FILM BY USING A LASER BEAM |
摘要 |
<p>This invention relates to an optical film cutting method which includes cutting an optical film by irradiating the optical film with a laser beam under conditions that an energy per unit length is 0.12 to 0.167 J/mm and that a continuous irradiation time is 0.1 msec or less; as well as to an optical film that is cut by the cutting method and has a size of a raised part generated on a cutting surface thereof of 30 µm or less. According to the optical film cutting method of this invention, it is possible to maintain the raised part size on the optical film cutting surface as small as possible even in the case where the laser beam has characteristics of a gaussian beam, thereby enabling prevention of bonding defect and optical defect when the optical film is incorporated into various optical panels.</p> |
申请公布号 |
EP2055423(B1) |
申请公布日期 |
2013.05.22 |
申请号 |
EP20070792747 |
申请日期 |
2007.08.20 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
NISHIDA, KANJI;HINO, ATSUSHI;AMANO, TAKAICHI;KITADA, KAZUO |
分类号 |
B23K26/38;B23K26/402;G02B5/30;H01S3/00 |
主分类号 |
B23K26/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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