发明名称 |
INSULATING SHEET, CIRCUIT BOARD, AND PROCESS FOR PRODUCTION OF INSULATING SHEET |
摘要 |
An object of the present invention is to provide an insulating sheet superior in heat dissipation efficiency, heat resistance, insulation efficiency and moldability. Provided is a sheet-shaped insulating sheet of a resin composition containing an epoxy resin, a curing agent and an inorganic filler, wherein one or both of the epoxy resin and the curing agent have a naphthalene structure, the inorganic filler contains hexagonal boron nitride, and the inorganic filler is contained in an amount of 70 to 85 vol % in the entire resin composition. It is possible to increase the filling efficiency of an inorganic filler in the insulating sheet by using an epoxy resin and/or a curing agent having a naphthalene structure, which are favorably compatible with the hexagonal boron nitride contained in the inorganic filler. |
申请公布号 |
EP2492924(A4) |
申请公布日期 |
2013.05.22 |
申请号 |
EP20100824736 |
申请日期 |
2010.09.13 |
申请人 |
DENKI KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
MIYATA KENJI;YAMAGATA TOSHITAKA |
分类号 |
H01B17/56;B32B15/092;B32B27/38;C08J5/18;C08L63/00;H01B3/00;H01B3/40;H01B19/00;H05K1/03 |
主分类号 |
H01B17/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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