发明名称 METHOD FOR MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR LIGHT EMITTING ELEMENT
摘要 <p>Sample A is produced by sequentially forming a first insulating film of SiO2 and a reflective film on a sapphire substrate. Sample B is produced by sequentially forming a first insulating film of SiO2, a reflective film, and a second insulating film of SiO2 on a sapphire substrate. In both samples A and B, the reflectance of the reflective film was measured at a wavelength of 450 nm before and after heat treatment. Heat treatment was performed at 600° C. for three minutes. As shown in FIG. 1, in Al/Ag/Al where Al has a thickness of 1 Å to 30 Å, Ag/Al where Al has a thickness of 20 Å, and Al/Ag/Al/Ag/Al where Al has a thickness of 20 Å, the reflectance was 95% or more, which is equivalent to or higher than that of Ag even after the heat treatment.</p>
申请公布号 KR20130052002(A) 申请公布日期 2013.05.21
申请号 KR20137007820 申请日期 2011.07.12
申请人 TOYODA GOSEI CO., LTD. 发明人 TOTANI SHINGO;DEGUCHI MASASHI;MORIYAMA MIKI
分类号 H01L33/32;H01L33/46 主分类号 H01L33/32
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