发明名称 |
Substrate cutting apparatus and method of cutting substrate using the same |
摘要 |
A substrate cutting apparatus includes a stage configured to support a substrate to be cut along a virtual cutting line, a laser generator configured to emit an ultraviolet (UV)-based laser beam for cutting the substrate by removing part of the substrate along the cutting line, and a beam oscillator disposed on a beam path of the laser beam and configured to perform a beam swing on the laser beam in a direction parallel to the length direction of the cutting line by oscillating a tilt angle of the laser beam toward the cutting line.
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申请公布号 |
US8445814(B2) |
申请公布日期 |
2013.05.21 |
申请号 |
US20100731305 |
申请日期 |
2010.03.25 |
申请人 |
LEE HYUN-CHUL;HAN GYOO-WAN;KIM JONG-DAE;PARK JIN-HAN;KIM JOON-HYUNG;KIM HYUNG-SIK;CHOI IN-SU;LEE YONG-JIN;SAMSUNG DISPLAY CO., LTD. |
发明人 |
LEE HYUN-CHUL;HAN GYOO-WAN;KIM JONG-DAE;PARK JIN-HAN;KIM JOON-HYUNG;KIM HYUNG-SIK;CHOI IN-SU;LEE YONG-JIN |
分类号 |
B23K26/00;B23K26/14;B23K26/16 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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