| 摘要 |
<p>PURPOSE: A printed circuit board and a manufacturing method thereof are provided to remove the fault due to a lifting of a dry film, by applying a solder resist instead of the dry film when forming the circuit pattern. CONSTITUTION: A solder resist is covered on an insulating material(S200). A cavity is formed in the insulating material and the solder resist(S210). A seed layer is formed on an insulating material surface which includes the inner cavity(S220). A circuit pattern is formed by coating the inner cavity(S230). The seed layer, which is on the surface of the solder resist, is removed(S240). The solder resist is coated on the solder resist in which the seed layer is removed(S250). A bump forming area of the coated solder resist in opened(S260). The bump is formed in the bump forming area(S270). [Reference numerals] (AA) Start; (BB) End; (S200) Cover a solder resist on an insulating material; (S210) Form a cavity in the insulating material and the solder resist; (S220) Form a seed layer on an insulating material surface including the inner cavity; (S230) Form a circuit pattern by coating the inner cavity; (S240) Remove the seed layer on the surface of the solder resist; (S250) Recoat solder resist on the solder resist in which the seed layer is removed; (S260) Open a bump forming area of the recoated solder resist; (S270) Form a bump in the bump forming area</p> |
