SILVER-CONTAINING ALLOY PLATING BATH AND METHOD FOR ELECTROLYTIC PLATING USING SAME

摘要

The present invention provides a silver-containing alloy electrolytic plating bath which can produce silver-containing alloy plated products having excellent resistance to oxidation suitable for electronic members, decoration members, and dental members, and a method for electrolytic plating using the same. Specifically the plating bath is to deposit a silver-containing alloy on the surface of the substrate. The silver-containing alloy plated products having excellent resistance to oxidation can be manufactured by using the plating bath which contains (a) a silver compound containing 99.9% to 46% by mass of silver on the basis of the total metal mass therein, (b) a gadolinium compound containing 0.1% to 54% by mass of gadolinium on the basis of the total metal mass therein, (c) at least one kind of complexing agent, and (d) a solvent, and by using the method for electrolytic plating applying the plating bath.