发明名称 |
Interconnects for packaged semiconductor devices and methods for manufacturing such devices |
摘要 |
Packaged semiconductor devices and assemblies including interconnects and methods for forming such interconnects are disclosed herein. One embodiment of a packaged semiconductor assembly includes a die attached to a support layer. A plurality of interconnects are embedded in and project from the support layer, such that the support layer at least partially retains the interconnects in a predetermined array. An encapsulant is molded around each of the interconnects and encases at least a portion of the die, support layer and interconnects.
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申请公布号 |
US8445330(B2) |
申请公布日期 |
2013.05.21 |
申请号 |
US201213459801 |
申请日期 |
2012.04.30 |
申请人 |
BOON SUAN JEUNG;CHIA YONG POO;ENG MEOW KOON;MICRON TECHNOLOGY, INC. |
发明人 |
BOON SUAN JEUNG;CHIA YONG POO;ENG MEOW KOON |
分类号 |
H01L21/00;H01L23/48 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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