发明名称 |
Multilayer wiring substrate having a castellation structure |
摘要 |
A multilayer wiring substrate has a through hole that passes from a first surface through to a second surface. The multilayer wiring substrate includes an electrical connection terminal formed in at least one of an inner edge portion which is a periphery of the through hole, an outer edge portion which is an outer periphery of the substrate, and a non-edge portion, on at least one of the first surface and the second surface. The electrical connection terminal has a castellation structure that does not pass through to a surface opposite to a formation surface.
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申请公布号 |
US8446002(B2) |
申请公布日期 |
2013.05.21 |
申请号 |
US20100659258 |
申请日期 |
2010.03.02 |
申请人 |
SHIBUTA NORIKO;TERASAKI TOHRU;YAMADA TOMOYASU;NAITO NOBUO;TSUKUDA YUKIHIKO;NONOYAMA RYU;SONY CORPORATION |
发明人 |
SHIBUTA NORIKO;TERASAKI TOHRU;YAMADA TOMOYASU;NAITO NOBUO;TSUKUDA YUKIHIKO;NONOYAMA RYU |
分类号 |
H01L23/053;H01L23/12;H01L27/14;H01L27/15;H01L29/267;H01L29/40;H01L29/73;H01L29/74;H01L31/00;H01L31/02;H01L31/111;H01L31/12;H01L33/00;H04N5/335 |
主分类号 |
H01L23/053 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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