发明名称 |
Liquid electrical interconnect and devices using same |
摘要 |
Various embodiments include interconnects for semiconductor structures that can include a first conductive structure, a second conductive structure and a non-hardening liquid conductive material in contact with the first and second structure. Other embodiments include semiconductor components and imager devices using the interconnects. Further embodiments include methods of forming a semiconductor structure and focusing methods for an imager device.
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申请公布号 |
US8445831(B2) |
申请公布日期 |
2013.05.21 |
申请号 |
US201113302907 |
申请日期 |
2011.11.22 |
申请人 |
LAKE RICK;BOETTIGER ULRICH;HEGDE SHASHIKANT;DUPARRE JACQUES;APTINA IMAGING CORPORATION |
发明人 |
LAKE RICK;BOETTIGER ULRICH;HEGDE SHASHIKANT;DUPARRE JACQUES |
分类号 |
H01L27/00;H01L23/48 |
主分类号 |
H01L27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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