发明名称 Multi-chip module
摘要 A multi-chip module includes: a board; a wiring board disposed on the board and including a wiring pattern; and a plurality of chips disposed on the wiring board. Each of the plurality of chips is connected with at least one of the other chips, and the plurality of chips and the board are electrically connected with each other via a portion other than the wiring pattern of the wiring board.
申请公布号 US8446020(B2) 申请公布日期 2013.05.21
申请号 US20100902527 申请日期 2010.10.12
申请人 KOIDE MASATERU;MIZUTANI DAISUKE;INOUE AIICHIRO;YAMASHITA HIDEO;YAMAZAKI IWAO;KATO MASAYUKI;UENO SEIJI;IMAMURA KAZUYUKI;FUJITSU LIMITED;FUJITSU SEMICONDUCTOR LIMITED 发明人 KOIDE MASATERU;MIZUTANI DAISUKE;INOUE AIICHIRO;YAMASHITA HIDEO;YAMAZAKI IWAO;KATO MASAYUKI;UENO SEIJI;IMAMURA KAZUYUKI
分类号 H01L23/48 主分类号 H01L23/48
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