| 发明名称 |
Methods of treating semiconducting materials including melting and cooling |
| 摘要 |
A method for treating semiconducting materials includes providing a semiconducting material having a crystalline structure, pre-heating a portion of the semiconducting material to a temperature less than the melting temperature of the semiconducting material, and then cooling the semiconducting material prior to exposing at least the portion of the semiconducting material to a heat source to create a melt pool, and cooling the semiconducting material.
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| 申请公布号 |
US8445364(B2) |
申请公布日期 |
2013.05.21 |
| 申请号 |
US20080156499 |
申请日期 |
2008.06.02 |
| 申请人 |
MAZUMDER PRANTIK;SONI KAMAL KISHORE;THOMAS CHRISTOPHER SCOTT;VENKATARAMAN NATESAN;COOK GLEN BENNETT;CORNING INCORPORATED |
发明人 |
MAZUMDER PRANTIK;SONI KAMAL KISHORE;THOMAS CHRISTOPHER SCOTT;VENKATARAMAN NATESAN;COOK GLEN BENNETT |
| 分类号 |
H01L21/20;C23C16/54;C30B15/14;H01L21/36;H01L33/00 |
主分类号 |
H01L21/20 |
| 代理机构 |
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代理人 |
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