发明名称 |
Electrochemical substrate slicing using electromagnetic wave excitation |
摘要 |
An apparatus for cutting a workpiece using electrochemical etching and a method of using thereof are described. The apparatus includes an electrochemical bath configured to contain an electrochemical solution, a support apparatus configured to support and immerse a workpiece in the electrochemical bath, and a non-contact cutting device configured to extend into the electrochemical bath and slice the workpiece via electrochemical etching along a cutting plane. The apparatus further includes an electromagnetic (EM) radiation source configured to illuminate a cutting surface formed between opposing sidewalls within an evolving cutting groove formed in the workpiece during slicing along the cutting plane.
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申请公布号 |
US8444848(B2) |
申请公布日期 |
2013.05.21 |
申请号 |
US20100697985 |
申请日期 |
2010.02.01 |
申请人 |
YUE HONGYU H.;LIU JUNJUN;TOMA DOREL I.;TOKYO ELECTRON LIMITED |
发明人 |
YUE HONGYU H.;LIU JUNJUN;TOMA DOREL I. |
分类号 |
B23H7/02;B23H7/38 |
主分类号 |
B23H7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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