发明名称 |
Anisotropic conductive film and light emitting device |
摘要 |
An anisotropic conductive film is provided that does not have a light-reflecting layer on a light emitting diode element which causes costs to increase when a light emitting device that uses an LED element is flip-chip mounted, and that does not cause emission efficiency to deteriorate. Further, a light emitting device that uses such an anisotropic conductive film is provided. This anisotropic conductive film has a structure in which a light-reflecting insulating adhesive layer and an anisotropic conductive adhesive layer are laminated, wherein the light-reflecting insulating adhesive layer has a structure in which light-reflecting particles are dispersed in an insulating adhesive. The light emitting device has a structure in which a light emitting diode element is flip-chip-mounted on a substrate, with this anisotropic conductive film provided between a connection terminal on the substrate and a bump for connection of the light emitting diode element.
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申请公布号 |
US8444882(B2) |
申请公布日期 |
2013.05.21 |
申请号 |
US201013142956 |
申请日期 |
2010.02.22 |
申请人 |
KANISAWA SHIYUKI;KUMAKURA HIROYUKI;NAMIKI HIDETSUGU;SONY CHEMICAL & INFORMATION DEVICE CORPORATION |
发明人 |
KANISAWA SHIYUKI;KUMAKURA HIROYUKI;NAMIKI HIDETSUGU |
分类号 |
H01B1/02;B32B5/16;H01B1/22;H01L33/00 |
主分类号 |
H01B1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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