| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film formation method and film formation device for preventing adherence between a substrate and a jig for mounting the substrate. <P>SOLUTION: A substrate 101 is mounted on a susceptor 102 being a jig arranged in a chamber 103 being a film formation chamber, and material gas 137 is supplied into the chamber 103 by the control of a gas control part 140 while rotating a rotation part 104 provided with a cylindrical part 104a for supporting the susceptor 102 at an upper part. In addition, purge gas 151 is supplied to the cylindrical part 104a to make the purge gas 151 go out between the substrate 101 and the susceptor 102, and the substrate 101 is rotated with at least a portion of the substrate 101 floating from the susceptor 102. Consequently, a prescribed film is formed on the substrate 101. <P>COPYRIGHT: (C)2013,JPO&INPIT |
