| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a long flexible wiring board for facilitating the microfabrication and multilayer of a wiring. <P>SOLUTION: An insulative adhesion layer 13 is inserted and positioned between one end parts of a first FPC one-layer single plate 11 and a second FPC one-layer single plate 12. The FPC one-layer single plates has a first insulator layer 14, a wiring layer 15a or 15b, and a second insulator layer 16. The areas of the one end parts are connected through the insulative adhesion layer 13 while the areas are positioned. Then, a through hole 17 and a through hole conductor 18 going through the one end parts and the insulative adhesion layer 13 are formed, and wirings between the wiring layers 15a, 15b are connected by the through hole conductor 18 to be a wiring layer 15. The two FPC one-layer single plates are individualized, and one FPC one-layer single plate is folded back in the vicinity of the area of the end part to be a long flexible wiring plate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
