| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor pattern inspection device, detecting a systematic defect without frequently issuing misinformation. <P>SOLUTION: Before an inspection, a feature amount calculation unit calculates as a preparation a feature amount representing the feature of each pattern from a design data 102 corresponding to a small amount of real images 101 (106a, 106b). Using this and teaching data 103 designating defect coordinates, an identification boundary calculation unit calculates an identification boundary, which is a rule to identify normality and a defect (107). At inspection, a feature amount is calculated from the real image 104 to be inspected and the design data 105, similar to the steps 106a, 106b (108a, 108b), and by applying thereto the identification boundary 107 calculated in the preparation before inspection, a defect determination unit performs defect determination 109. <P>COPYRIGHT: (C)2013,JPO&INPIT |
