发明名称 |
NITRIDE SEMICONDUCTOR ELEMENT, NITRIDE SEMICONDUCTOR DEVICE, NITRIDE SEMICONDUCTOR WAFER AND NITRIDE SEMICONDUCTOR ELEMENT MANUFACTURING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a nitride semiconductor element which can obtain ohmic contact between a nitride semiconductor layer and an electrode while inhibiting a damage applied to the nitride semiconductor layer. <P>SOLUTION: A light-emitting element (nitride semiconductor element) 1 comprises: a substrate 10 having a principal surface 10a; and a semiconductor layer 20 including an n-type layer 20a, an n-type contact layer 20b and a p-type layer 20d. The principal surface 10a has a predetermined off angle with respect to an m-plane in an a-axis direction. The semiconductor layer 20 includes an inclined region 21 and a non-inclined region 22. In the inclined region 21, an n electrode 40 is formed on predetermined regions of the n-type layer 20a and the n-type contact layer 20b. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013098475(A) |
申请公布日期 |
2013.05.20 |
申请号 |
JP20110242301 |
申请日期 |
2011.11.04 |
申请人 |
SHARP CORP |
发明人 |
KUBO SHOSAKU |
分类号 |
H01L33/38;C23C16/34;H01L21/205;H01L21/28;H01L29/41;H01L33/22;H01L33/32 |
主分类号 |
H01L33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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