SILICONE RESIN COMPOSITION FOR SEMICONDUCTOR LIGHT EMITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a silicone resin composition for a semiconductor light emitting device having satisfactory adhesiveness to a metal wiring board such as a lead frame and high reflectance and being effective in enhancement of LED output.

SOLUTION: The silicone resin composition for the semiconductor light emitting device contains the following components (A) to (C). Excellent board adhesiveness is obtained by using both an adhesive polyorganosiloxane having a specified functional group and an organic titanium compound and board adhesiveness and high reflectance can be compatibly obtained by performing white compensation using a prescribed amount of alumina. (A) 100 pts.wt. polyorganosiloxane containing an alkoxy group and containing an alkenyl group and hydrosilyl group in the range of 1/0.1 to 1/10 as alkenyl group/hydrosilyl group (equivalent ratio). (B) 0.01 to 10 pts.wt, organic titanium compound, and (C) 5 to 400 pts.wt. alumina.

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