SUBSTRATE PROCESSING SYSTEM, SUBSTRATE TRANSFER METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing system which includes a function for cleaning a rear surface of a substrate before exposure and reduces the footprint without changing the configuration of a processing unit.

SOLUTION: In an application and development processing system including a processing station and an interface station 5, the interface station 5 has: a cleaning unit 100 which cleans a rear surface of a wafer before the wafer is carried into an exposure device; an inspection unit 101 inspecting whether or not exposure can be performed on the wafer after the cleaning; and a wafer transfer mechanism 120 including an arm transferring the wafer between the cleaning unit 100 and the inspection unit 101. The cleaning unit 100 and the inspection unit 101 are provided at the front surface side of the interface station 5 in a multi-stage form in a vertical direction, and the wafer transfer mechanism 120 is provided in a region located adjacent to the cleaning unit 100 and the inspection unit 101.

COPYRIGHT: (C)2013,JPO&INPIT