| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a secondary nozzle body in which a bridge or icicle can be prevented from being generated and there is not risk that a molten solder may be spread over an upper face of a work. <P>SOLUTION: With a secondary nozzle body 60, after a molten solder is jetted from a primary nozzle to a lower face of a moving printed circuit board, a molten solder is jetted from a jetting port 61 for performing soldering to the lower face of the printed circuit board. The jetting port 61 is turned upright, a wave width adjusting plate 70 is provided behind the jetting port 61 that becomes a downstream side with respect to a moving direction of the printed circuit board, the wave width adjusting plate 70 forms an upper face part 71 having a width which is approximately equal to that of the jetting port 61 in a direction orthogonal with the moving direction of the printed circuit board, and a fixed height and a rear end 71c of the upper face part 71 is inclined with respect to the moving direction. <P>COPYRIGHT: (C)2013,JPO&INPIT |
