| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing liquid composition capable of reducing the surface roughness (center line average roughness) of a substrate, the number of scratches and the number of particles without sacrificing productivity, and to provide a method for manufacturing the substrate and a method for polishing the substrate using the polishing liquid composition. <P>SOLUTION: The polishing liquid composition includes: colloidal silica particles (component A) having an average particle diameter of 45 nm or less; a compound having a cyclodextrin skeleton (component B) of 50-2,000 ppm; a water-soluble polymer having an anionic group with a weight-average molecular weight Mw of 50,000 or less (component C) of 120-1,000 ppm; and water (component D). The pH of the polishing liquid composition at 25°C is 1.8 or less. <P>COPYRIGHT: (C)2013,JPO&INPIT |
