| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package substrate in which a via hole intermediate layer is embedded and a manufacturing method thereof. <P>SOLUTION: A package substrate in which a via hole intermediate layer is embedded comprises: a mold seal layer 22; a via hole intermediate layer 20 embedded in the mold seal layer and having a plurality of conductive via holes 200; a re-wiring layer 21 embedded in the mold seal layer, provided in the via hole intermediate layer, and electrically connected to one end surface of the conductive via hole; and a build-up structure 23 provided in the mold seal layer and the via hole intermediate layer and electrically connected to the other end surface of the conductive via hole. Embedding the via hole intermediate layer in the mold seal layer causes the re-wiring layer to be electrically connected to an electrode pad of a relatively small semiconductor chip and the other end to be electrically connected to a conductive blind via hole of a relatively large build-up structure. This connection also causes a package substrate 2 to be connected to a semiconductor chip having a high wiring density. <P>COPYRIGHT: (C)2013,JPO&INPIT |
