| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such problems that a method for measuring a semiconductor pattern corresponding to various types of patterns have not been disclosed, especially, a method for measuring an object pattern with both sides thereof being constituted of straight or curved lines and being nonparallel have not been disclosed. <P>SOLUTION: The method for measuring a semiconductor pattern is a method in which capturing an image of a pattern formed on a semiconductor wafer and measuring a pattern dimension on the basis of the captured image. The method includes the steps of: identifying edge positions on both sides of the pattern on the image; performing a measurement on the basis of a line segment connecting a first point and a second point, where the first point is located on a first edge of the pattern, and the second point is located on a second edge opposite to the first edge, a first tangential line of the first edge at the first point, and a second tangential line of the second edge at the second point; and measuring a distance of the line segment. <P>COPYRIGHT: (C)2013,JPO&INPIT |
