| 发明名称 |
EPOXY RESIN COMPOSITION FOR ENCAPSULATION, PRODUCTION METHOD FOR ELECTRONIC DEVICE USING THE SAME, AND THE ELECTRONIC DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulation capable of reducing deformation of a wire in compression molding. <P>SOLUTION: The particulate epoxy resin composition for encapsulation is characterized in that when the epoxy resin composition is received in an aluminum foil vessel so as to cover all of the bottom surface of the aluminum foil vessel having a flat bottom and cured by heating it under atmospheric pressure and at 175°C for three min, the area of a void formed on a surface contacting the bottom surface of the cured epoxy resin composition to the total of the surface contacting the bottom surface of the cured epoxy resin composition is ≤40%. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013095911(A) |
申请公布日期 |
2013.05.20 |
| 申请号 |
JP20110243081 |
申请日期 |
2011.11.07 |
| 申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
ITO YUSUKE |
| 分类号 |
C08L63/00;C08K3/00;H01L23/29;H01L23/31 |
主分类号 |
C08L63/00 |
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