| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress damage on a silicon chip as much as possible by reducing a stress when a sealing member for sealing a boundary between an exposed part of the silicon chip and a sealing part is attached to the silicon chip in a method for manufacturing a semiconductor device formed by sealing one part of the silicon chip with a mold resin and exposing the other part from the mold resin. <P>SOLUTION: The method for manufacturing semiconductor devices includes: preparing an annular shrink seal member 60 comprising a material shrunk by heat application, as a sealing member; inserting a silicon chip 10 in the shrink seal member 60 so as to be provided on a boundary 13; applying heat to the shrink seal member 60 to complete the shrinkage; and, in the mold step thereafter, injecting mold resin 20, with the silicon chip 10 pressed with a metal mold 100 via the shrink seal member 60. <P>COPYRIGHT: (C)2013,JPO&INPIT |
