发明名称 LAMINATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a laminate having high thermal conductivity of an insulating layer and high adhesion between the insulating layer and an electric conductive layer. <P>SOLUTION: The laminate 1 includes a thermal conductor 2 with thermal conductivity of 10 W/m.k or more, and first and second insulating layers 3 and 4. The first and second insulating layers 3 and 4 are formed by using the same curable composition. The first and second insulating layers 3 and 4 contain an inorganic filler with the thermal conductivity of 10 W/m.k or more, respectively. The curing rate of the first insulating layer 3 is 50% or more, and the curing rate of the second insulating layer 4 is less than 80%. The curable composition contains a liquid epoxy compound with viscosity at 25&deg;C of 15,000 mPa s or less, or a crystalline epoxy compound with a melting point lower than 140&deg;C. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013094988(A) 申请公布日期 2013.05.20
申请号 JP20110237246 申请日期 2011.10.28
申请人 SEKISUI CHEM CO LTD 发明人 MAENAKA HIROSHI;KONDO SHUNSUKE;WATANABE TAKASHI;HIGUCHI ISAO
分类号 B32B27/38;B32B15/092;H01L23/373 主分类号 B32B27/38
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