| 摘要 |
<P>PROBLEM TO BE SOLVED: To allow for high-quality data transfer while suppressing a larger circuit scale. <P>SOLUTION: A single-end I/F having pads for exchanging a single end signal is provided in a millimeter wave transmission chip, for example, a semiconductor chip. Meanwhile, for example, a differential transmission line such as a coplanar strip line which transmits a differential signal is formed in a packaging section in which semiconductor chips such as an interposer and a printed-circuit board are mounted. The millimeter wave transmission chip is mounted in the packaging section so that the pads of the single-end I/F are electrically connected directly to a conductor constituting the differential transmission line. This technique, for example, is applicable to electronic circuits such as IC. <P>COPYRIGHT: (C)2013,JPO&INPIT |
