发明名称 PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS AND LONG OBJECT SUBJECTED TO PLASMA PROCESSING
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma processing method capable of performing uniform surface treatment of a long workpiece thoroughly, and to provide a plasma processing apparatus using the plasma processing method and exhibiting excellent operability. <P>SOLUTION: A guide consisting of a plurality of disc-like guide members 5a arranged in the longitudinal direction of a first cylindrical part 2 is provided. At least one bearing hole 5c is formed to penetrate the guide member 5a in the thickness direction. A long workpiece W is inserted into the bearing hole 5c and supported, and then guide to a region where the density of plasma is high, i.e., the vicinity of the inner wall of the first cylindrical part 2. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013097904(A) 申请公布日期 2013.05.20
申请号 JP20110237324 申请日期 2011.10.28
申请人 OKINO AKITOSHI;MIYAHARA SHUICHI;SUNLINE CO LTD 发明人 OKINO AKITOSHI;MIYAHARA SHUICHI;TSUTSUMI HIDENOBU;NAKASAKI YORIHITO;OGAWA TAKAYUKI;SUIZU KEITA
分类号 H05H1/24;C08J7/00;D06M10/02 主分类号 H05H1/24
代理机构 代理人
主权项
地址