发明名称 |
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS AND LONG OBJECT SUBJECTED TO PLASMA PROCESSING |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma processing method capable of performing uniform surface treatment of a long workpiece thoroughly, and to provide a plasma processing apparatus using the plasma processing method and exhibiting excellent operability. <P>SOLUTION: A guide consisting of a plurality of disc-like guide members 5a arranged in the longitudinal direction of a first cylindrical part 2 is provided. At least one bearing hole 5c is formed to penetrate the guide member 5a in the thickness direction. A long workpiece W is inserted into the bearing hole 5c and supported, and then guide to a region where the density of plasma is high, i.e., the vicinity of the inner wall of the first cylindrical part 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013097904(A) |
申请公布日期 |
2013.05.20 |
申请号 |
JP20110237324 |
申请日期 |
2011.10.28 |
申请人 |
OKINO AKITOSHI;MIYAHARA SHUICHI;SUNLINE CO LTD |
发明人 |
OKINO AKITOSHI;MIYAHARA SHUICHI;TSUTSUMI HIDENOBU;NAKASAKI YORIHITO;OGAWA TAKAYUKI;SUIZU KEITA |
分类号 |
H05H1/24;C08J7/00;D06M10/02 |
主分类号 |
H05H1/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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