| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a non-contact communication medium which is excellent in surface smoothness for reducing the influence of an impact or the like from the outside to an IC module, and for reducing possibility that any failure or communication failure occurs even with configurations in which the mold part of the IC module is exposed from an opening formed in a base material of an inlay. <P>SOLUTION: The non-contact communication medium includes: a first base material and a second base material; an antenna formed in the second base material; and an IC module connected to the antenna. The non-contact communication medium is characterized such that an opening from which the mold part of the IC module is exposed is formed, and that the width of the front insulation layer surface of a protective tape for sealing the opening is larger than the width of the back adhesive layer surface. <P>COPYRIGHT: (C)2013,JPO&INPIT |
