SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package in which a semiconductor chip is encapsulated by a resin with a part being exposed and which minimizes an influence on an exposed part caused by an external foreign material and the like.

SOLUTION: In a semiconductor package comprising a semiconductor chip 10 and a resin 20 encapsulating the semiconductor chip 10 and a part of one surface 10a of the semiconductor chip 10 is exposed from the resin 20 as an exposed part 11, the resin 20 positioned around the exposed part 11 on the one surface 10a side of the semiconductor chip 10 forms a conical-shaped space part 21 such that a part on the exposed part 11 side is wider and narrows with the increasing distance from the exposed part 11 and having a hole 22 opening outward on the top. The exposed part 11 is positioned in the space part 21 and exposed outward from the resin 20 via the hole 22.

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