| 摘要 |
<P>PROBLEM TO BE SOLVED: To make a coolant successfully flow to a downstream cooling plate in a power module in which cooling plates and semiconductor packages are laminated alternately. <P>SOLUTION: A power module 100 has a structure in which a plurality of cooling plates 2 and a plurality of semiconductor packages 3 storing semiconductor devices are laminated alternately. In the cooling plate 2, through holes 12a, 12b are formed on both sides of a region 12 to which the semiconductor package 3 is abutted, and a flow passage in which a coolant passes from one through hole to the other through hole is formed within the cooling plate 2. The through holes of the cooling plate adjacent to each other are connected to each other. A coolant supply pipe 8 and a coolant discharge pipe 7 are connected to two through holes of the outermost cooling plate 2a located at one end of a laminated body, respectively. A flow passage cross section S1 of a connecting portion between at least one of the supply pipe 8 and the discharge pipe 7 and the cooling plate 2a is set larger than a flow passage cross section S2 of a connecting pipe 5 interconnecting the through holes. <P>COPYRIGHT: (C)2013,JPO&INPIT |
