| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sensor device easily mounted on a mother board. <P>SOLUTION: The sensor device includes a sensor substrate (10), a circuit board (30) and a package (50) which is mounted on a mother board (200). The package (50) includes a bottom (51), an annular side wall section (52) formed at the bottom 51, and a lid section (53) for closing an opening of the side wall section 52. The sensor substrate (10) is arranged in a sealed space formed by the bottom (51), the side wall section (52) and the lid section (53). The circuit board (30) is arranged outside the sealed space, and a protrusion (56) having a z-direction length longer than the circuit board (30) is formed on an outer wall surface (51b) of the bottom (51) connected with the circuit board (30) thereto. The protrusion (56) is connected to the mother board (200). <P>COPYRIGHT: (C)2013,JPO&INPIT |
