| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an attachment and a stage for a flip chip bonder which manufacture a highly reliably semiconductor device while inhibiting voids, to provide a method for joining a semiconductor chip to a facing substrate using the attachment for the flip chip bonder, an attachment-heater combined body including the attachment for the flip chip bonder, and the flip chip bonder. <P>SOLUTION: An attachment is used for a flip chip bonder for holding a semiconductor chip having a protruding electrode, transmitting heat and pressure to the semiconductor chip, and joining the semiconductor chip to a facing substrate through a sealing resin. In the attachment for the flip chip bonder, heat conductivity is lower in an inner part of a portion projected from the semiconductor chip than in a peripheral part of the portion. <P>COPYRIGHT: (C)2013,JPO&INPIT |
