发明名称 WIRE PROCESSING DEVICE AND WIRE PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a wire processing device and a wire processing method, which can increase the manufacturing efficiency of wires by eliminating the complicated adjustment work, prevent the damage on a core wire and shield braid, and make the cut surface of insulation coating neat. <P>SOLUTION: A wire processing device comprises a pair of notch cutters 31 and 32 which separates insulation coating 91 having a notch C along the longitudinal direction of a wire 90 by cutting the insulation coating 91 in the circumferential direction, which is provided so that the cutters 31 and 32 can freely approach or separate from each other, and which enters the insulation coating 91. The pair of notch cutters 31 and 32 has blades 35 and 36 along the circumferential direction of the insulation coating 91, and the blade 35 of one notch cutter 31 has a linear part 35C extending linearly toward the other side. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013099223(A) 申请公布日期 2013.05.20
申请号 JP20110243156 申请日期 2011.11.07
申请人 YAZAKI CORP 发明人 ARAKI MAMORU;TAKAHASHI KATSUYOSHI
分类号 H02G1/12 主分类号 H02G1/12
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