| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase a degree of adhesion of a metal film formed on an inner wall of a through hole formed in a single-layer insulating substrate, thereby obtaining a container for an electronic component, whose size and height have been reduced, and an electronic device using the container. <P>SOLUTION: A circuit board 1 includes: a single-layer insulating substrate 10; a through hole 15; and wiring conductors 20a and 20b provided for respective principal planes of the single-layer insulating substrate. The through hole 15 includes: a first recess 15a and a second recess 15b formed for respective principal planes of the single-layer insulating substrate; and a through part 15c for establishing communication between the recesses. An aperture area of an overlapping part between the first recess 15a and the second recess 15b is 1/2 or less of an aperture area of larger one of the recesses and a metal film 16 is formed for each of inner wall surfaces of the first recess 15a, the second recess 15b, and the through part 15c. <P>COPYRIGHT: (C)2013,JPO&INPIT |
