发明名称 COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a coil component which can cope with high-temperature reflow and also is superior in vibration resistance. <P>SOLUTION: The coil component has a structure in which a coil electrode 12 containing Cu as a main component and a terminal electrode 16 containing Cu as a main component are electrically and mechanically connected to each other by solder having rod-like metallic compounds 23 that have Cu<SB POS="POST">3</SB>Sn as a core dispersed in Sn alloy 22, and in which an outer package 19 is composed by molding a region including the coil electrode 12 and the solder. Thereby, even when the solder melts, the solder can be prevented from coming out from the outer package 19. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013098280(A) 申请公布日期 2013.05.20
申请号 JP20110238364 申请日期 2011.10.31
申请人 PANASONIC CORP 发明人 MATSUMOTO YOSHIAKI;UMEDA TAKASHI
分类号 H01F27/29;H01F27/02;H01F27/28;H01F27/32;H01F41/04 主分类号 H01F27/29
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