,申请号JP20120549950-传众专利搜索

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发明名称
摘要	<p>A silicone resin is provided. The silicone resin may be effectively used to encapsulate a semiconductor element, for example, a light-emitting element of a light-emitting diode.</p>
申请公布号	JP2013518143(A)	申请公布日期	2013.05.20
申请号	JP20120549950	申请日期	2011.01.25
申请人		发明人
分类号	C08G77/04;C08L83/05;C08L83/07	主分类号	C08G77/04
代理机构		代理人
主权项
地址

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