| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can sufficiently inhibit adverse effects by rigidity deterioration of a polishing pad caused by wearing of the polishing pad. <P>SOLUTION: A wafer polishing apparatus comprises: a polishing pad 2 provided on a polishing table 1; a polishing head 4 relatively transferring a wafer 3 with respect to the polishing pad 2 in a state where the wafer 3 touches the polishing pad 2 to polish the wafer 3; and a temperature control part 6 controlling a temperature of the polishing pad 2 depending on a thickness of the polishing pad 2 after polishing. <P>COPYRIGHT: (C)2013,JPO&INPIT |
