METHOD OF POLISHING USING TUNABLE POLISHING FORMULATION

摘要

PROBLEM TO BE SOLVED: To provide a method for chemical mechanical polishing of a substrate having a polysilicon overburden deposited over silicon nitride using multiple dilutions of a chemical mechanical polishing composition concentrate to polish the substrate.

SOLUTION: In the method, a first dilution of the concentrate used to polish the substrate is tuned to exhibit a first polysilicon removal rate and a first polysilicon-to-silicon nitride removal rate selectivity; and a second dilution of the concentrate used to polish the substrate is tuned to exhibit a second polysilicon removal rate and a second polysilicon-to-silicon nitride removal rate selectivity.

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