| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder handling device that has such a shape as not to require a projection or an extra member, can exhibit a temperature adjustment function, and performs a highly reliable temperature lock function as needed. <P>SOLUTION: The solder handling device provided with a heat generation part 4 includes: a variable resistor 7 provided in the control circuit of the heat generation part 4; and a knob lower member 10 that can adjust the resistance value of the variable resistor 7 in the casing 5 of the device. A mechanism to lock the rotation of the knob lower member 10 is also provided. The mechanism is elastically deformably provided and an elastic part 10g, which controls the rotation of the knob lower member 10, is provided in a free status. Preferably, the operation of the elastic part 10g is controlled by key receiving parts 10e and 10f that permit a push-in motion only into the specific shape members 22 and 41 provided on the operation members (knob 20 and temperature adjustable handle 40). The elastic part 10g is separated from the casing 5 and released from a lock status by elastically being deformed by the specific shape members 22 and 41 pushed inside from the outside of the casing 5. <P>COPYRIGHT: (C)2013,JPO&INPIT |
