发明名称 MULTIPLICATION SYSTEM OF FLIP CHIP MOUNTERS
摘要 PURPOSE: A multiplication system for a flip chip mounter is provided to smoothly transfer a substrate by arranging a plurality of flip chip mounters in a line. CONSTITUTION: A plurality of flip chip mounters(110,130) are arranged in a line. A first wafer transfer device(310,320,330) is located on one side of the flip chip mounter and supplies a wafer to the flip chip mounter. A first shuttle conveyor(410,420,430) transfers a substrate on the upper side of the first wafer transfer device in a second direction. A second shuttle conveyor(210,220,230) transfers the substrate on the upper side of the flip chip mounter in the second direction.
申请公布号 KR20130051254(A) 申请公布日期 2013.05.20
申请号 KR20110116500 申请日期 2011.11.09
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 AHN, GEUN SIK;CHO, JEONG HO;KANG, TAE WOO
分类号 H01L21/677;B65G49/07;H01L21/50 主分类号 H01L21/677
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