发明名称 |
MULTIPLICATION SYSTEM OF FLIP CHIP MOUNTERS |
摘要 |
PURPOSE: A multiplication system for a flip chip mounter is provided to smoothly transfer a substrate by arranging a plurality of flip chip mounters in a line. CONSTITUTION: A plurality of flip chip mounters(110,130) are arranged in a line. A first wafer transfer device(310,320,330) is located on one side of the flip chip mounter and supplies a wafer to the flip chip mounter. A first shuttle conveyor(410,420,430) transfers a substrate on the upper side of the first wafer transfer device in a second direction. A second shuttle conveyor(210,220,230) transfers the substrate on the upper side of the flip chip mounter in the second direction. |
申请公布号 |
KR20130051254(A) |
申请公布日期 |
2013.05.20 |
申请号 |
KR20110116500 |
申请日期 |
2011.11.09 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
AHN, GEUN SIK;CHO, JEONG HO;KANG, TAE WOO |
分类号 |
H01L21/677;B65G49/07;H01L21/50 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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