发明名称 PACKAGING DEVICE, COMPONENT SHORTAGE DETERMINATION METHOD AND PROGRAM
摘要 <P>PROBLEM TO BE SOLVED: To provide a technology with which component shortage of a supply section can be determined accurately. <P>SOLUTION: A packaging device comprises a supply section, a hold section, a first sensor, a second sensor and a control section. The supply section supplies electronic components. The hold section holds the electronic component supplied from the supply section and packages the electronic component on a substrate. The first sensor and the second sensor are configured to detect component shortage of the electronic component supplied from the supply section. The control section executes first component shortage determination processing to determine whether the component shortage of the electronic component occurs or not on the basis of output from the first sensor and, if the occurrence of the component shortage is determined in the first component shortage determination processing, executes second component shortage determination processing to determine whether the component shortage occurs or not on the basis of output from the second sensor. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013098414(A) 申请公布日期 2013.05.20
申请号 JP20110241144 申请日期 2011.11.02
申请人 SONY CORP 发明人 ISHIDA KEISUKE
分类号 H05K13/02 主分类号 H05K13/02
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