THIN MULTI LAYER PRINTED CIRCUIT BOARD USING PI CORE AND MANUFATURING MATHOD THEREFOR

摘要

PURPOSE: A thin type multi-layer printed circuit substrate capable of using the polyimide core and a manufacturing method thereof are provided to form the core layer of the multi-layer printed circuit substrate with the polyimide material, thereby providing the highly reliable printed circuit substrate when implementing a micro-pattern. CONSTITUTION: A core layer(110) is comprised of the polyimide material. A circuit pattern layer(150) is formed on both sides or one side of the core layer. A bonding layer is formed between the core layer and the circuit pattern layer. The bonding layer comprises a first bonding layer(120) which bonds the core layer and the circuit pattern layer, and a second bonding layer(130) which is formed on the first bonding layer. A conductive layer(140) is formed between the bonding layer and the circuit pattern layer.