| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a component for a power semiconductor module having high thermal conductivity and adhesiveness of an insulating layer. <P>SOLUTION: A method for manufacturing a component 11 for a power semiconductor module uses a laminate 1 including a thermal conductor 2 and first and second insulating layers 3 and 4 containing an inorganic filler. The first and second insulating layers 3 and 4 are formed by using the same curable composition, and contain an inorganic filler having a thermal conductivity of 10 W/m K or more, respectively. The curing ratio of the first insulating layer 3 is 50% or more, and the curing ratio of the second insulating layer 4 is less than 80%. The curable composition contains a liquid epoxy compound having a viscosity at 25°C of 15,000 mPa s or less or a crystalline epoxy compound having a melting point of lower than 140°C. <P>COPYRIGHT: (C)2013,JPO&INPIT |
