| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing adhesive tape for semiconductor processing which has adhesive force for sufficiently holding a wafer in a process for applying dicing processing to a semiconductor wafer and prevents an individualized package from being adhered to a tray or a device after package dicing. <P>SOLUTION: In a dicing tape for semiconductor processing, a radiation hardening type adhesive layer is formed on at least one side of a base film, the adhesive layer is made of resin composition having an acrylic polymer as a base polymer, the thickness of the adhesive layer is 10 to 30 μm, adhesive force after radiation exposure to SUS304 based on JIS Z0237 of the adhesive layer is 90°, when a peeling-off test is performed, tape width is 1.0 to 2.0 N/25 mm, and peak intensity of a probe tack after radiation exposure under an atmosphere condition of the adhesive layer is 50 to 150 mN/mm<SP POS="POST">2</SP>. <P>COPYRIGHT: (C)2013,JPO&INPIT |
